Methods and systems for making an electrode free from a polymer binder
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United States of America Patent
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May 17, 2016
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app pub date -
Apr 18, 2013
filing date -
Apr 18, 2013
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Abstract
The disclosure describes an exemplary binding layer formed on Aluminum (Al) substrate that binds the substrate with a coated material. Additionally, an extended form of the binding layer is described. By making a solution containing Al-transition metal elements-P—O, the solution can be used in slurry making (the slurry contains active materials) in certain embodiments. The slurry can be coated on Al substrate followed by heat treatment to form a novel electrode. Alternatively, in certain embodiments, the solution containing Al-transition metal elements-P—O can be mixed with active material powder, after heat treatment, to form new powder particles bound by the binder.
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