Pick-up method of die bonder and die bonder
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United States of America Patent
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May 17, 2016
Grant Date -
Sep 27, 2012
app pub date -
Sep 2, 2011
filing date -
Mar 23, 2011
priority date (Note) -
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Abstract
When a die to be stripped out of plural dies (semiconductor chips) bonded to a dicing film is to be tossed and stripped from the dicing film, the dicing film corresponding to predetermined positions out of the peripheral portion of the die is tossed to form stripping start points. The dicing film corresponding to portions other than the above predetermined positions is then tossed to strip the die from the dicing film.
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