Resin composition with high dielectric insulation properties
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United States of America Patent
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May 17, 2016
Grant Date -
Oct 2, 2014
app pub date -
Jan 24, 2013
filing date -
Jan 30, 2012
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Abstract
Provided is a resin composition with high dielectric insulation properties that has a dielectric constant of at least 20, a dielectric tangent of 0.1 or less, outstanding insulation properties (at least 1012 Ω·cm), and for use in electrical power, communication devices, and the like. A resin composition with high dielectric insulation properties comprises a constituent (A), which is 100 parts by mass of a polymer material that acts as a dispersion medium for constituent (B), and a constituent (B), which is 100-3000 parts by mass of a perovskite complex oxide powder comprising secondary particles formed by the mutual bonding of primary particles through sintering and represented by the formula: ABO3.
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