Semiconductor fabrication process
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United States of America Patent
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May 17, 2016
Grant Date -
Dec 4, 2014
app pub date -
Aug 21, 2014
filing date -
Oct 27, 2009
priority date (Note) -
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Abstract
Semiconductor fabrication processes are described. An embodiment of the semiconductor fabrication process includes providing a layer formed by decomposition of dimethylsilane through chemical vapor deposition, the layer being applied by a fluid material, and then positioning the layer in a system for producing a semiconductor product. Additionally or alternatively, the semiconductor product is produced and/or the layer is on a substrate.
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