Lead-free solder alloy
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United States of America Patent
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May 17, 2016
Grant Date -
Feb 6, 2014
app pub date -
Apr 16, 2012
filing date -
Apr 15, 2011
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Abstract
The present invention provides a lead-free solder alloy having high reliability and excellent solder bonding properties and suited for the mounting of micronized electronic components at low cost. The lead-free solder alloy according to the present invention has a composition containing 0.5 to 1.5 wt % of Ag, 0.3 to 1.5 wt % of Cu, 0.01 to 0.2 wt % of Ni, 1.0 wt % or less of Ga, and the balance being Sn and unavoidable impurities.
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