Method and apparatus for dispensing flux-free solder on a substrate
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United States of America Patent
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May 17, 2016
Grant Date -
Jan 9, 2014
app pub date -
Jun 12, 2013
filing date -
Jul 5, 2012
priority date (Note) -
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Abstract
An apparatus for dispensing flux-free solder comprises a dispenser head with a stamp to which ultrasound can be applied. Solder is dispensed by:
- A) moving the dispenser head above a next substrate place,B) lowering the stamp until the working surface of the stamp touches the substrate place or is located at a predetermined height above the substrate place,C) dispensing solder by: C1) advancing the solder wire until the solder wire touches the substrate place, in such a manner that the tip of the solder wire touches the substrate place within a recess of the stamp,C2) further advancing of solder wire to melt a predetermined quantity of solder, andC3) retracting the solder wire, D) moving the dispenser head to distribute the solder on the substrate place, and simultaneously applying ultrasound to the stamp, andE) raising the stamp.
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