System for removing an electronic component from a substrate
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United States of America Patent
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May 10, 2016
Grant Date -
Apr 2, 2015
app pub date -
Dec 6, 2014
filing date -
Apr 22, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A system and method for removing an electronic component from a substrate is described. In one embodiment, a system includes a heating device to heat a substrate, wherein an electronic component such as a microchip is attached to the substrate by one or more solder connections. A thermally conductive picker head is placed in physical contact with the electronic component to apply tension to the electronic component and draw heat away from the electronic component through a thermally conductive interface between the electronic component and the thermally conductive picker head. This ideally generates a uniform temperature gradient across the solder connections. This will allow the electronic component along with most or all of the solder to be removed from the substrate.
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