EMI shielding and thermal dissipation for semiconductor device
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United States of America Patent
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May 10, 2016
Grant Date -
Jan 16, 2014
app pub date -
Dec 16, 2011
filing date -
Dec 16, 2011
priority date (Note) -
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Abstract
A memory device including a metallic layer shielding electromagnetic radiation and/or dissipating heat, and a method of making the memory device, are disclosed. The metallic layer is formed on a metallic layer transfer assembly. The metallic layer transfer assembly and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the metallic layer is transferred from the shield to the encapsulated memory device.
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