Formulation for packaging an electronic device and assemblies made therefrom

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United States of America Patent

PATENT NO 9337152
SERIAL NO

13843505

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Abstract

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Disclosed and claimed herein is a formulation for packaging an electronic device and assemblies made therefrom.

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Patent Owner(s)

Patent OwnerAddress
CUBIC CORPORATION9333 BALBOA AVENUE SAN DIEGO CA 92123

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MacDonald, James D Chandler, US 15 419
Sherrer, David William Radford, US 2 37

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  • 1 Citation Count
  • H01L Class
  • 13.47 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1792827316886303131891006776342711301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000

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11.5 Year Payment $7400.00 $3700.00 $1850.00 Nov 10, 2027