Signal bond wire shield
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United States of America Patent
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May 10, 2016
Grant Date -
N/A
app pub date -
Sep 1, 2015
filing date -
Sep 1, 2015
priority date (Note) -
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Abstract
A semiconductor device includes a semiconductor die having opposing first and second main surfaces, contact pads and a metal ring accessible from the first main surface, and signal leads surrounding and spaced from the die. Each of the signal leads has a first end near the die, a second end remote from the die, and a body extending between the first and second ends. A dummy lead frame is disposed between the signal leads first ends and the die, and connected to a fixed potential. First bond wires are coupled to respective ones of the signal leads and the contact pads. Second, shield bond wires, located adjacent to respective ones of the bond wires, are coupled to the dummy lead frame and the metal ring.
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