Deformation sensor package and method
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United States of America Patent
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May 10, 2016
Grant Date -
May 7, 2015
app pub date -
Nov 4, 2013
filing date -
Nov 4, 2013
priority date (Note) -
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Abstract
A deformation sensor package includes a housing having a base and a peripheral wall extending from the base. The base and peripheral wall define two cavities each configured to receive a potentiometer, such as a string potentiometer. The peripheral wall defines two apertures formed between a respective cavity and an exterior of the housing. Each aperture is configured to allow for the passage of a moveable sensing end of an associated potentiometer therethrough.
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