Powder, sintered body and sputtering target, each containing elements of Cu, In, Ga and Se, and method for producing the powder

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United States of America Patent

PATENT NO 9334559
APP PUB NO 20130098758A1
SERIAL NO

13807538

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Abstract

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The present invention provides a Cu—In—Ga—Se powder containing Cu, In, Ga and Se in which cracks do not occur during sintering or processing, and a sintered body and sputtering target, each using the same. The present invention relates to a powder containing Cu, In Ga and Se, which contains a Cu—In—Ga—Se compound and/or a Cu—In—Se compound in an amount of 60 mass % or more in total. The powder of the present invention preferably contains an In—Se compound in an amount of 20 mass % or less and/or a Cu—In compound in an amount of 20 mass % or less.

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Patent Owner(s)

Patent OwnerAddress
KOBELCO RESEARCH INSTITUTE INC1-5-1 WAKINOHAMA-KAIGAN-DORI CHUO-KU KOBE-SHI HYOGO 6510073 ?6510073
HYOGO PREFECTURE10-1 SHIMOYAMATEDORI 5-CHOME CHUO-KU KOBE-SHI HYOGO 6508567 ?6508567

International Classification(s)

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  • 2011 Application Filing Year
  • C23C Class
  • 1852 Applications Filed
  • 1328 Patents Issued To-Date
  • 71.71 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2011201220132014201520162017201820192020202120220255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ehira, Masaya Hyogo, JP 10 123
Fukuzumi, Masafumi Hyogo, JP 2 1
Kashiwai, Shigeo Hyogo, JP 1 1
Nambu, Akira Hyogo, JP 16 70

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Patent Citation Ranking

  • 0 Citation Count
  • C23C Class
  • 0 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges27293913750251255742501 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0501001502002503003504004505005506006507007508008509009501000

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11.5 Year Payment $7400.00 $3700.00 $1850.00 Nov 10, 2027