Hot melt adhesive based on low melting point polypropylene homopolymers
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United States of America Patent
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May 10, 2016
Grant Date -
Nov 27, 2014
app pub date -
May 21, 2014
filing date -
May 23, 2013
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Abstract
A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has
- a) about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.;b) about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.;c) about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin;d) about 5% to about 50% of a plasticizer;e) about 1% to about 40% by weight of a secondary polymer which is either a semi-crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram;f) about 0.1% to about 5% of a stabilizer or antioxidant;wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).
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