Photosensitive resin composition and black spacer using the same
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United States of America Patent
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May 10, 2016
Grant Date -
Jun 12, 2014
app pub date -
Oct 28, 2013
filing date -
Dec 12, 2012
priority date (Note) -
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Abstract
Disclosed are a photosensitive resin composition including (A) a thermally curing initiator having a half-life of about one hour at a temperature ranging from about 100 to about 150° C.; (B) a photopolymerization initiator; (C) a binder resin; (D) a photopolymerizable compound; (E) a colorant; and (F) a solvent, and a black spacer using the same.
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