Method and device for cutting out hard-brittle substrate and protecting regions on the substrate
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United States of America Patent
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May 10, 2016
Grant Date -
Nov 14, 2013
app pub date -
May 1, 2013
filing date -
May 8, 2012
priority date (Note) -
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Abstract
To cut out a hard-brittle substrate by blasting, laying out substrates 2 on a plate material 1 made of a hard-brittle material with leaving a space for blasting; forming first protective films 4 on both surfaces of the plate material 1 at layout positions of the substrates 2; and forming second protective films 5 on both surfaces of a margin 3 of the plate material 1 with leaving a space with respect to the first protective films 4 and having outer edges from a periphery of the plate material 1 at a width of 5 mm or less; cutting regions 6 between the films 4, 4 and between the films 4, 5 from one surface of the plate material 1 to a depth of approximately half of a thickness thereof by blasting, then cutting from the other surface of the plate material 1 until the plate material 1 is penetrated.
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