Data center module with leveling pad
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United States of America Patent
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May 3, 2016
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N/A
app pub date -
Nov 20, 2012
filing date -
Nov 20, 2012
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Abstract
A system includes a floor, one or more modules, one or more pads between a base of the modules and the floor, and one or more pad compression mechanisms. The data center modules include more electrical systems coupled to the module base. The pads compress to conform to variations in the surface of the floor. The pad compression mechanisms are operable by a user to compress the pads between the modules and the floor.
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