Process for etching a recessed structure filled with tin or a tin alloy
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United States of America Patent
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May 3, 2016
Grant Date -
Jan 2, 2014
app pub date -
Feb 9, 2012
filing date -
Mar 22, 2011
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Abstract
A process for etching excess tin or tin alloy deposits including the steps of providing a substrate having recessed structures filled with tin or a tin alloy and an excess layer of tin or tin alloy, providing an aqueous etching solution consisting of a source of hydroxide ions and a nitro-substituted aromatic sulfonic acid and having a pH value greater than 7, and contacting said substrate with said aqueous etching solution for removing said excess tin or tin alloy layer on top of the recessed structures filled with tin or a tin alloy.
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