Ball grid array rework
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United States of America Patent
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May 3, 2016
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N/A
app pub date -
Aug 26, 2015
filing date -
Jul 7, 2014
priority date (Note) -
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Abstract
Embodiments of the invention relates to a method for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.
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