Vibrator with a beam-shaped portion above a recess in a substrate, and oscillator using same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9331668
APP PUB NO 20140292427A1
SERIAL NO

14218053

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for manufacturing a vibrator according to the present invention includes: forming a coating layer that covers a silicon substrate; patterning the coating layer; forming a semiconductor layer that covers the silicon substrate and the coating layer; forming a vibrating portion having a beam shape on the coating layer and a support portion that supports the vibrating portion by patterning the semiconductor layer; forming an opening that exposes the silicon substrate; forming a recess portion by removing the silicon substrate through the opening; and removing the coating layer. In the step of forming the vibrating portion and the support portion, the support portion having a first portion that is located on the silicon substrate, and a second portion that connects the first portion and the vibrating portion and is located on the coating layer is formed.

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Patent Owner(s)

Patent OwnerAddress
SEIKO EPSON CORPORATIONTOKYO 160-8801

International Classification(s)

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  • 2014 Application Filing Year
  • H03B Class
  • 380 Applications Filed
  • 341 Patents Issued To-Date
  • 89.74 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2014201520162017201820192020202120220255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yoshizawa, Takahiko Sakata, JP 22 70

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Patent Citation Ranking

  • 0 Citation Count
  • H03B Class
  • 0 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges5225944994201 - 1011 - 2021 - 3031 - 4041 - 5071 - 80020406080100120140160180200220240260280

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11.5 Year Payment $7400.00 $3700.00 $1850.00 Nov 3, 2027