Semiconductor die laminating device with independent drives
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United States of America Patent
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May 3, 2016
Grant Date -
Apr 30, 2015
app pub date -
May 7, 2012
filing date -
May 7, 2012
priority date (Note) -
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Abstract
A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.
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