Solder bump sealing method and device

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United States of America Patent

PATENT NO 9330874
APP PUB NO 20160042902A1
SERIAL NO

14456972

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Abstract

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A method for forming a cavity in a microfabricated structure, includes the sealing of that cavity with a low temperature solder. The method may include forming a sacrificial layer over a substrate, forming a flexible membrane over the sacrificial layer, forming a release hole through a flexible membrane to the sacrificial layer, introducing an etchant through the release hole to remove the sacrificial layer, and then sealing that release hole with a low temperature solder.

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Patent Owner(s)

  • INNOVATIVE MICRO TECHNOLOGY

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Patil, Vikram Santa Barbara, US 10 82
Zeyen, Benedikt Santa Barbara, US 15 55

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