Ytterbium sputtering target and method of producing said target
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United States of America Patent
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May 3, 2016
Grant Date -
Feb 25, 2010
app pub date -
Feb 5, 2009
filing date -
Feb 8, 2008
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Abstract
Provided is a method of producing an ytterbium sputtering target, wherein an ytterbium target material having Vickers hardness (Hv) of the material surface of 15 or more and 40 or less is prepared in advance, and a surface of the ytterbium target material having the foregoing surface hardness is subject to final finish processing by way of machining. With the ytterbium sputtering target, present invention aims to remarkably reduce the irregularities (gouges) on the target surface after the final finish processing of the target material, and to inhibit the generation of particles during sputtering.
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