Method and device for contacting, positioning and impinging a solder ball formation with laser energy
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United States of America Patent
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May 3, 2016
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Jan 24, 2008
filing date -
Jan 24, 2007
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Abstract
The invention relates to a method and a device for contacting a solder ball formation, in which a plurality of contact mouthpieces arranged in a formation is used to pick up a solder ball formation with a composition reflecting the relative arrangement of the contact mouthpieces from a solder ball reservoir comprising a multitude of randomly distributed solder balls, the solder ball formation is placed on contact points by means of the contact mouthpieces for subsequently contacting, and subsequently the solder balls are impinged with laser energy by means of the contact mouthpieces for thermal connection with the contact points.
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