Current applying device
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United States of America Patent
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Apr 26, 2016
Grant Date -
Nov 13, 2014
app pub date -
May 5, 2014
filing date -
May 8, 2013
priority date (Note) -
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Abstract
A current applying device in which a contact electrode is destroyed firstly when a large current is applied in the event of failure. A probe device is configured by serially connecting a contact body that is to be in contact with the surface of a power semiconductor to apply a current and a pressing body assembly that presses the contact body so as to apply the current to the power semiconductor and is configured so that, when the pressing body power applied to the pressing body assembly is smaller than the withstand power of the pressing body assembly, the contact body power applied to the contact body is larger than the withstand power of the contact.
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