Three-dimensional hot spot localization

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United States of America Patent

PATENT NO 9322715
APP PUB NO 20140346360A1
SERIAL NO

14294016

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A non-destructive approach for the 3D localization of buried hot spots in electronic device architectures by use of Lock-in Thermography (LIT). The 3D analysis is based on the principles of thermal wave propagation through different material layers and the resulting phase shift/thermal time delay. With more complex multi level stacked die architectures it is necessary to acquire multiple LIT results at different excitation frequencies for precise hot spot depth localization. Additionally, the use of multiple time-resolved thermal waveforms, measured in a minimized field of view on top of the hot spot location, can be used to speed up the data acquisition. The shape of the resulting waveforms can be analyzed to further increase the detection accuracy and confidence level.

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Patent Owner(s)

Patent OwnerAddress
FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E VHANSASTRASSE 27C MÜNCHEN 80686
DCG SYSTEMS INC45900 NORTHPORT LOOP EAST FREMONT CA 94538

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Altmann, Frank Halle, DE 5 39
Deslandes, Herve Sunnyvale, US 12 64
Schlangen, Rudolf San Francisco, US 7 53
Schmidt, Christian Halle, DE 142 944

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11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 26, 2027