Wafer level integration of focal plane arrays having a flexible conductive layer to provide an optical aperture for each pixel
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United States of America Patent
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Apr 19, 2016
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N/A
app pub date -
May 29, 2014
filing date -
May 29, 2013
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Abstract
Apparatus, systems, and methods related to focal plane arrays can be used in a variety of applications. In various embodiments, focal plane arrays can be fabricated on a wafer integration level based on arrangement of a flexible conductive layer for photosensitive pixels of the focal plane arrays. Arrangement of a flexible conductive layer allows for a number of architectures of focal plane arrays. Additional apparatus, systems, and methods are disclosed.
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