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United States of America Patent
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Apr 19, 2016
Grant Date -
Mar 12, 2015
app pub date -
Nov 19, 2014
filing date -
Nov 8, 2011
priority date (Note) -
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Abstract
An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side.
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