Collet cleaning method and die bonder using the same
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United States of America Patent
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Apr 19, 2016
Grant Date -
Sep 11, 2014
app pub date -
Dec 12, 2013
filing date -
Mar 11, 2013
priority date (Note) -
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Abstract
An object of the present invention is to provide a collet cleaning method and a die bonder using the same in which a collet can be cleaned without adding a new unit, and foreign substances with 5 high adhesive power can be reliably removed without scattering the foreign substances. A die bonder includes a pickup device, a bonding head unit having a collet that absorbs dies from a wafer at the timing of lifting of the pickup device, and a control unit that controls the pickup device 10 and the bonding head unit. The collet is moved to a position of a dicing tape at which no dies of the wafer held by a wafer ring exist to be brought into contact with the adhesive surface of the dicing tape, so that foreign substances attached to the tip end of the collet are removed.
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