Pattern forming method, actinic-ray-sensitive or radiation-sensitive resin composition, and resist film

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United States of America Patent

PATENT NO 9316910
APP PUB NO 20120219913A1
SERIAL NO

13406306

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Abstract

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Provided is a pattern forming method that is excellent in roughness performance such as line width roughness and exposure latitude, and an actinic-ray-sensitive or radiation-sensitive resin composition and a resist film used for the pattern forming method.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATIONTOKYO 106-0031

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kataoka, Shohei Shizuoka, JP 40 201
Saitoh, Shoichi Shizuoka, JP 14 64
Shirakawa, Michihiro Shizuoka, JP 102 248
Takahashi, Hidenori Shizuoka, JP 205 2284
Yamaguchi, Shuhei Shizuoka, JP 106 393
Yoshino, Fumihiro Shizuoka, JP 31 60

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