Ephemeral bonding

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9315696
SERIAL NO

14069348

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
DDP SPECIALTY ELECTRONIC MATERIALS US INC400 ARCOLA ROAD COLLEGEVILLE PA 19426

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bai, Zhifeng Midland, US 26 29
Brantl, Karen R West Springfield, US 12 125
Gallagher, Michael K Hopkinton, US 91 1302
Iagodkine, Elissei Marlborough, US 11 34
Oliver, Mark S Charlestown, US 11 20
Tucker, Christopher J Midland, US 55 534
Wang, Zidong Southborough, US 28 73

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 19, 2027
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00