Method using glass substrate anodic bonding
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United States of America Patent
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Apr 19, 2016
Grant Date -
Jul 2, 2015
app pub date -
Dec 27, 2013
filing date -
Dec 27, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.
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International Classification(s)
- 2013 Application Filing Year
- B81C Class
- 446 Applications Filed
- 316 Patents Issued To-Date
- 70.86 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B81C Class
- 0 % this patent is cited more than
- 9 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 19, 2027 |
