Solder handling assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9314863
APP PUB NO 20130105466A1
SERIAL NO

13666745

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A solder handling assembly comprises a heating portion, a casing, a variable resistor, a connecting member coupled to the variable resistor, and an elastic-resilient member movable from a first state to a second state. The connecting member is rotatable relative to the casing and is configured to adjust a resistor value of the variable resistor when the connecting member is rotated relative to casing. When the elastic-resilient member is in the first state, the connecting member is prevented from rotating relative to the casing. When the elastic-resilient member is in the second state, the connecting member can be rotated relative to the casing.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
HAKKO CORPORATION4-5 SHIOKUSA 2-CHOME NANIWA-KU OSAKA CITY OSAKA 556-0024

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Teraoka, Yoshitomo Osaka, JP 35 258

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 19, 2027
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00