Package substrate
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United States of America Patent
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Apr 12, 2016
Grant Date -
Apr 4, 2013
app pub date -
Nov 30, 2012
filing date -
Mar 12, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the first principal surface, on which first bonding materials for mounting are provided. An internal circuit is provided within the main package body and connected to the first bonding materials. A sub-package is arranged on the second principal surface and includes electronic components embedded therein. A thickness direction dimension being the distance from the second principal surface to a portion of the sub-package most distant from the second principal surface, is not more than a thickness direction dimension being the distance from the second principal surface to an edge of the first bonding material at the second principal surface.
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