Method and system for localized heat treating using susceptor
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United States of America Patent
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Apr 12, 2016
Grant Date -
Apr 24, 2014
app pub date -
Oct 22, 2012
filing date -
Oct 22, 2012
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Abstract
A system or method for heat treating a localized area of a component part includes providing a susceptor, shaping the susceptor to conform to the component part, a component part, and a heat source, heating the susceptor by the heat source, and introducing the susceptor to the desired target area of the component part for a controlled or predetermined interval as necessary to achieve a desired metallurgical effect to take place with respect to the desired target area.
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