Method for fabricating light emitting diode (LED) dice with wavelength conversion layers
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United States of America Patent
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Apr 12, 2016
Grant Date -
Mar 12, 2015
app pub date -
Nov 14, 2014
filing date -
Sep 12, 2011
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Abstract
A method for fabricating light emitting diode (LED) dice includes the step of providing a wavelength conversion layer on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy, such as electromagnetic radiation or heat. The method also includes the step of exposing the adhesive layer on the substrate to the physical energy to reduce the adhesiveness of the adhesive layer, removing the wavelength conversion layer from the substrate, and attaching the wavelength conversion layer to the light emitting diode (LED) die.
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