Impurity-doped layer formation apparatus and electrostatic chuck protection method
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United States of America Patent
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Apr 12, 2016
Grant Date -
Jan 24, 2013
app pub date -
Jul 13, 2012
filing date -
Jul 14, 2011
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Abstract
An electrostatic chuck protection method includes providing an exposed chuck surface with a protective surface for preventing adherence of foreign materials including a substance exhibiting volatility in a vacuum environment, and removing the protective surface in order to perform a process of forming a substrate electrostatically held on the chuck surface with a surface layer including a substance having volatility in a vacuum chamber. The protective surface may be provided when a low vacuum pumping mode of operation is performed in a vacuum environment surrounding the chuck surface.
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