Heat dissipating module with enhanced heat dissipation efficiency and electronic device therewith
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United States of America Patent
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Apr 12, 2016
Grant Date -
Apr 10, 2014
app pub date -
Jul 18, 2013
filing date -
Oct 8, 2012
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Abstract
A heat dissipating module includes a main body, a heat dissipating unit and at least one resilient engaging unit. A side of the heat dissipating unit is connected to the main body and the other side of the heat dissipating unit contacts against at least one heat component. An end of the at least one resilient engaging unit is connected to a side of the main body and the other end of the at least one resilient engaging unit engages with a side of a fastening base. The at least one resilient engaging unit is for resiliently pressing the main body so that the dissipating unit contacts with the at least one heat component closely.
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