Hot-melt adhesive temperature control method, applicator therefor, and bookbinding apparatus

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United States of America Patent

PATENT NO 9308766
APP PUB NO 20070193511A1
SERIAL NO

11676510

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Abstract

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Bookbinding apparatus adhesive applicator accurately, briefly controls adhesive temperature to a set value by selecting, in accordance with adhesive initial temperature, one of a plurality of temperature-controller heating modes defining different supply powers and supply durations for supplying power to an adhesive-container heater to control its heating temperature. A sensor detects the temperature of the adhesive in the container at applicator start-up, or on restarting a post-standby applicator. In accordance with the detected temperature, one of the heating modes is selected to heat the adhesive. The applicator warm-up time is thus set in response to the state of the adhesive: If solidified, the adhesive is heated and melted in a maximum supply-power, supply-duration mode; if low-temperature liquefied at, it is heated and melted in a second-magnitude supply-power, supply-duration mode; and if the adhesive temperature is high, it is heated and melted in a minimal supply-power, supply-duration mode.

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Patent Owner(s)

Patent OwnerAddress
NISCA CORPORATION430-1 KOBAYASHI FUJIKAWA-CHO MINAMIKOMA-GUN YAMANASHI-KEN 400-0593

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sasamoto, Shinya Hokuto, JP 21 137
Tsuchiya, Atsushi Minami Alps, JP 52 280

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