Integrated circuit device substrates having packaged crystal resonators thereon
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United States of America Patent
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Apr 5, 2016
Grant Date -
N/A
app pub date -
Dec 30, 2014
filing date -
Aug 30, 2013
priority date (Note) -
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Abstract
An integrated circuit device includes an integrated circuit substrate having a two piece package thereon. The package has a hermetically sealed cavity therein and a crystal resonator within the cavity. The crystal resonator includes at least one electrode electrically coupled to a portion of the integrated circuit substrate by an electrically conductive via, which extends at least partially through the package. The package may include a material selected from a group consisting of glass and ceramics. The crystal resonator includes a crystal blank and first and second electrodes on first and second opposing sides of the crystal blank. The package includes a base having a recess therein and a cap hermetically sealed to the base. The cap includes first and second electrical traces thereon, which are electrically connected to the first and second electrodes of the crystal resonator.
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