Method of producing substrate and superconducting wire
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United States of America Patent
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Apr 5, 2016
Grant Date -
May 3, 2012
app pub date -
Jun 15, 2010
filing date -
Jul 10, 2009
priority date (Note) -
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Abstract
The present invention relates to a method of producing a substrate, including the steps of preparing a substrate having a nickel layer formed on a copper layer through plating, subjecting the nickel layer to thermal treatment at 800-1000° C., and epitaxial-growing an intermediate layer on the nickel layer, after the step of subjecting the nickel layer to thermal treatment. According to the present invention, there can be provided a substrate that allows the orientation and flatness at the surface of a nickel layer to be improved, and a method of producing the substrate.
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