Sealing system for creating sealed letter by use of envelope sheet with bond part

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United States of America Patent

PATENT NO 9302443
APP PUB NO 20130225384A1
SERIAL NO

13765270

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Abstract

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A sealing system for creating a sealed letter by use of an envelope sheet with a bond part on a basis of a sealing setting. The sealing system includes a transmission amount detector configured to detect an amount of transmission of the envelope sheet being conveyed on a conveyance path, a bond position calculator configured to calculate a first bond position where the bond part exists in the envelope sheet on a basis of the amount of transmission as detected by the transmission amount detector, and a judgment unit configured to judge whether the envelope sheet is conveyed a correct way round in a conveyance direction of the envelope sheet, from the first bond position as calculated by the bond position calculator and a second bond position based on the sealing setting.

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Patent Owner(s)

Patent OwnerAddress
RISO KAGAKU CORPORATION5-34-7 SHIBA MINATO-KU TOKYO 108-8385

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yabune, Hirokazu Ibaraki-ken, JP 8 13

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11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 5, 2027
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