Substrate structure, semiconductor package device, and manufacturing method of substrate structure
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United States of America Patent
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Mar 29, 2016
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app pub date -
Nov 29, 2012
filing date -
Nov 29, 2011
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Abstract
A substrate structure includes first, second and third metal layers embedded in a dielectric layer between its opposite upper first and lower second surfaces. The entire upper surface of the first metal layer is exposed on the first surface of the dielectric layer, the entire lower surface of the third metal layer is exposed on the second surface of the dielectric layer, and the second metal layer is disposed between the first metal layer and the third metal layer, wherein the area of the third metal layer is larger than the area of the second metal layer.
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