Heat sink for electronic device and process for production thereof

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United States of America Patent

PATENT NO 9299636
APP PUB NO 20120186800A1
SERIAL NO

13499308

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Abstract

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A heat sink for an electronic device includes a Cr—Cu alloy layer including a Cu matrix and more than 30 mass % and not more than 80 mass % of Cr; and Cu layers provided on top and rear surfaces of the Cr—Cu alloy layer.

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Patent Owner(s)

Patent OwnerAddress
JFE PRECISION CORPORATION2-3 KAMIOSE-CHO NIIGATA-SHI NIIGATA 950-0063

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kobiki, Hidoaki Tokyo, JP 1 1
Terao, Hoshiaki Niigata, JP 9 44

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