Method of manufacturing lead frame
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United States of America Patent
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Mar 29, 2016
Grant Date -
Nov 6, 2014
app pub date -
Feb 18, 2014
filing date -
May 6, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
There is provided a method of manufacturing a lead frame, the method including: preparing a lead frame raw material; forming openings in the lead frame raw material so that the lead frame material includes: a die pad; a die pad supporting portion supporting the die pad; a rail portion supporting the die pad supporting portion; a lead supporting portion having both ends fixed to the die pad supporting portion; and a plurality of leads having a first end connected to the rail portion and a second end connected to the lead supporting portion; plating the lead frame raw material having the openings with a plating layer; and removing the lead supporting portion.
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