Ink for direct inkjet printing to plate based on nanometer material and method for preparing the same
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United States of America Patent
Stats
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Mar 29, 2016
Grant Date -
Oct 2, 2014
app pub date -
Jun 1, 2012
filing date -
Jun 2, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An ink used for direct inkjet printing to plate based on nanometer material and a method for preparing same. Of the baseline total amount of the ink, 5 to 30 wt % is of film-forming resin, 0.01 to 5 wt % is of nanometer or micrometer dye, 30 to 60 wt % is of organic solvent, 0.01 to 5 wt % is of humectant, and water provides the balance; these ingredients are stirred and mixed at room temperature, and after the film-forming resin is completely dissolved, impurities and/or insoluble substances in the present invention are removed by means of multi-level filtering, and the obtained filtrate is the present ink. The ink in the present invention is sprayed on a metal base material surface by an inkjet printer to form a printing pattern which, after curing, can be directly printed on the machine, thus reducing chemical pollution and post-processing processes, while a press run of the printing plate can be up to 100,000 copies at a resolution of up to 175 lpi.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
CN | A | CN102807783 | Jun 02, 2011 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
UNEXAMINED APPLICATION FOR A PATENT FOR INV. | Ink for printing and directly making plate used in nanometer material and preparation method thereof | Dec 05, 2012 | |||
JP | B2 | JP5937203 | Jun 01, 2012 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
PUBLISHED GRANTED PATENT (SECOND LEVEL) | ナノメートル材料に基づくアルミニウム基材、亜鉛基材または銅基材への直接インクジェット印刷用のインクおよびその調製方法 | Jun 22, 2016 | |||
EP | B1 | EP2727970 | Jun 01, 2012 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
Patent | Ink for direct inkjet printing to plate based on nanometer material and method for preparing the same | Nov 16, 2016 | |||
WO | A1 | WO2012163288 | Jun 01, 2012 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
INTERNATIONAL APPLICATION PUBLISHED WITH INTERNATIONAL SEARCH REPORT | 用于纳米材料打印直接制版的墨水及其制备方法 | Dec 06, 2012 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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INSTITUTE OF CHEMISTRY CHINESE ACADEMY OF SCIENCES | 100190 NO 2 NORTH FIRST STREET HAIDIAN DISTRICT BEIJING ZHONGGUANCUN BEIJING CITY BEIJING CITY 100190 |
International Classification(s)

- 2012 Application Filing Year
- C09D Class
- 1743 Applications Filed
- 1306 Patents Issued To-Date
- 74.93 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Kuang, Minxuan | Beijing, CN | 1 | 2 |
# of filed Patents : 1 Total Citations : 2 | |||
Song, Yanlin | Beijing, CN | 27 | 35 |
# of filed Patents : 27 Total Citations : 35 | |||
Zhou, Haihua | Beijing, CN | 35 | 135 |
# of filed Patents : 35 Total Citations : 135 |
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Patent Citation Ranking
- 2 Citation Count
- C09D Class
- 20.04 % this patent is cited more than
- 9 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 29, 2027 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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Oct 26, 2020 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Oct 26, 2020 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Sep 23, 2020 | FP | LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Sep 23, 2020 |
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Mar 09, 2016 | FPAY | FEE PAYMENT | year of fee payment: 8 |
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Sep 23, 2008 | I | Issuance | |
Sep 03, 2008 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Oct 01, 2004 | AS | ASSIGNMENT | free format text: MERGER;ASSIGNOR:HITACHI UNISIA AUTOMOTIVE, LTD.;REEL/FRAME:016245/0106 Owner name: HITACHI, LTD., JAPAN Effective Date: Oct 01, 2004 |
Nov 21, 2002 | P | Published | |
Jul 26, 2002 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:OHISHI, YUJI;MORITA, HIKARU;NAKAZAWA, CHIHARU;AND OTHERS;REEL/FRAME:013139/0129;SIGNING DATES FROM 20020520 TO 20020521 Owner name: UNISIA JECS CORPORATION, JAPAN |
Apr 25, 2002 | F | Filing | |
Apr 25, 2001 | PD | Priority Date |

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