Method for producing a printing stencil for technical printing for applying a printed pattern to a substrate and printing stencil for technical printing
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United States of America Patent
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Mar 29, 2016
Grant Date -
Oct 16, 2014
app pub date -
Aug 30, 2012
filing date -
Aug 30, 2011
priority date (Note) -
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Abstract
Disclosed is a method for producing a printing stencil for technical printing for applying a printed pattern to a substrate and to a printing stencil. The method includes supplying a carrier layer, supplying a structure layer, said layer being located beneath the carrier layer, making an elongate printed image opening, corresponding to at least part of the printed pattern, in the structure layer, and making carrier layer openings in the region of the printed image opening. The method uses a laser device designed to emit a laser beam in pulses, and includes making a row of carrier layer openings, extending in the longitudinal direction of the printed image opening, wherein, for making a carrier layer opening, a focusing apparatus is positioned near the carrier layer opening, and the carrier layer opening is by means of one or several laser pulses, and the focusing apparatus of the laser device.
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