Method and device for the injection of CMP slurry
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United States of America Patent
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Mar 29, 2016
Grant Date -
Jan 9, 2014
app pub date -
Dec 16, 2010
filing date -
Dec 16, 2010
priority date (Note) -
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Abstract
In a certain embodiment, the invention comprises an apparatus for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising an injector the leading edge of which possess bays, depressions or notches that capture spent slurry and hold it long enough for it to transfer heat from the polishing reaction to the pad or through the injector to the new slurry before the said spent slurry is thrown from the polishing pad. The effect is to considerably improve the removal rate, reduce slurry consumption and reduce operating time.
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