Laser processing machine, in particular laser cutting machine, and method for centering a laser beam, in particular a focused laser beam
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 29, 2016
Grant Date -
Jan 16, 2014
app pub date -
Jul 26, 2013
filing date -
Jan 27, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Laser processing machines (LM), in particular laser cutting machines with long-wave laser radiation (in particular CO2 laser), including at least one laser processing head (1), having interior (2) and nozzle (3) with nozzle orifice (4) for allowing a primary beam (5), in particular a focused laser working beam, to pass through and onto a work piece (6) and to align a gas current enveloping the beam, and an alignment device (15) with several sensors (13) for centering the primary beam (5), in particular a focused laser working beam, and the nozzle orifice (4) relative to each other. At least one conversion unit (9), in particular a conversion edge, is provided in the area of the nozzle orifice (4) for converting the primary beam (5) contacting it or impacting on it into one or more secondary electromagnetic heat beams (10) along at least one propagation direction (10A) in direction of the sensors (13). The sensors (13) are configured as radiation sensors and arranged in the interior (2) of the laser processing head (1) or the nozzle (3).
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully