Method for removing electroplated metal facets and reusing a barrier layer without chemical mechanical polishing
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United States of America Patent
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Mar 22, 2016
Grant Date -
Mar 12, 2015
app pub date -
Sep 11, 2014
filing date -
Sep 11, 2013
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Abstract
A method for avoiding using CMP for eliminating electroplated copper facets and reusing barrier layer in the back end of line (“BEOL”) manufacturing processes. Electropolishing is employed to remove the deposited surface metal, stopping at the barrier layer to form a smooth surface that may be utilized in subsequent steps. The method is suitable for the electropolishing of metal surfaces after formation of filled vias for through-silicon via processes employing metals such as copper, tungsten, aluminum, or alloys thereof. The remaining barrier layer may be reused to fabricate the redistribution layer.
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