Laser processing machine, laser cutting machine, and method for adjusting a focused laser beam
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United States of America Patent
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Mar 22, 2016
Grant Date -
Dec 19, 2013
app pub date -
Jul 20, 2013
filing date -
Jan 27, 2011
priority date (Note) -
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Abstract
Laser processing machines and methods for adjusting focused laser beams. Laser processing heads have nozzle with openings admitting primary laser beam. An orientation device is included, as well as at least one sensor to mutually center primary beam and opening of nozzle. A first beam handling unit is arranged near the nozzle opening and may convert primary beam into a secondary wide-band heat beam, and then may emit this secondary beam towards a sensor; or may reflect/scatter at least a portion of the primary beam towards sensor. The sensor detecting the converted secondary beam is arranged within the laser processing head. In an adjustment process, a primary beam may be converted into a wide-band heat radiation as secondary radiation at the beam handling unit, and emitted and/or diverted into a scattered/reflex beam towards the sensor. Respective position of nozzle opening center and primary beam is calculated from sensor-measured values, and nozzle center and beam center are automatically displaced to mutual center. The axial position of beam focus may be also be measured and set via the nozzle centering procedure.
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